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| HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6017 Issued Date : 1996.04.12 Revised Date : 2003.01.17 Page No. : 1/3 HJ127 PNP EPITAXIAL PLANAR TRANSISTOR Description * High DC current gain * Built-in a damper diode at E-C Absolute Maximum Ratings (Ta=25C) TO-252 * Maximum Temperatures Storage Temperature ........................................................................................................ -55 ~ +150 C Junction Temperature ................................................................................................................ +150 C * Maximum Power Dissipation Total Power Dissipation (Tc=25C)................................................................................................. 20 W * Maximum Voltages and Currents BVCBO Collector to Base Voltage ............................................................................................... -100 V BVCEO Collector to Emitter Voltage ............................................................................................ -100 V BVEBO Emitter to Base Voltage ...................................................................................................... -5 V IC Collector Current ......................................................................................................................... -5 A Characteristics (Ta=25C) Symbol BVCBO BVCEO BVEBO ICBO IEBO ICEX *VCE(sat)1 *VCE(sat)2 *VBE(sat) *VBE(on) *hFE1 *hFE2 Cob Min. -100 -100 -5 1 100 Typ. Max. -10 -2 -10 -2 -4 -4.5 -2.8 12 300 Unit V V V uA mA uA V V V V K pF Test Conditions IC=-1mA, IE=0 IC=-30mA, IB=0 IE=-1mA, IC=0 VCB=-100V, IE=0 VEB=-5V, IC=0 VCE=-100V, VBE(off)=-1.5V IC=-4A, IB=-16mA IC=-8A, IB=-80mA IC=-8A, IB=-80mA VCE=-4V, IC=-4A VCE=-4V, IC=-4A VCE=-4V, IC=-8A VCB=-10V, f=0.1MHz *Pulse Test: Pulse Width 380us, Duty Cycle2% Darlington Schematic C B R1 R2 E HJ127 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 10000 10000 Spec. No. : HE6017 Issued Date : 1996.04.12 Revised Date : 2003.01.17 Page No. : 2/3 Saturation Voltage & Collector Current hFE @ VCE=4V Saturation Voltage (mV) 1000 hFE 100 1000 VBE(sat) @ IC=100IB VCE(sat) @ IC=100IB 10 1 1 10 100 1000 10000 100 10 100 1000 10000 Collector Current (mA) Collector Current (mA) On Voltage & Collector Current 10000 10 Switching Time & Collector Current VCC=30V, IC=250IB1=-250IB2 Switching Times (us) On Voltage (mV) Tstg 1 Tf Ton 1000 VBE(on) @ VCE=4V 100 1 10 100 1000 10000 0.1 1 10 Collector Current (mA) Collector Current (A) Capacitance & Reverse-Biased Voltage 1000 100000 PT=1ms 10000 Safe Operating Area Collector Current-IC (mA) PT=100ms PT=1s Capacitance (pF) 1000 100 Cob 100 10 10 0.1 1 10 100 1 1 10 100 Reverse-Biased Voltage (V) Forward Voltage-VCE (V) HJ127 HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-252 Dimension A C Spec. No. : HE6017 Issued Date : 1996.04.12 Revised Date : 2003.01.17 Page No. : 3/3 Marking: H 127 Date Code J B D Control Code L F G Style: Pin 1.Base 2.Collector 3.Emitter 3 H E K 2 I 1 J 3-Lead TO-252 Plastic Surface Mount Package HSMC Package Code: J *: Typical DIM A B C D E F Inches Min. Max. 0.0177 0.0217 0.0650 0.0768 0.0354 0.0591 0.0177 0.0236 0.2520 0.2677 0.2125 0.2283 Millimeters Min. Max. 0.45 0.55 1.65 1.95 0.90 1.50 0.45 0.60 6.40 6.80 5.40 5.80 DIM G H I J K L Inches Min. Max. 0.0866 0.1102 *0.0906 0.0354 0.0315 0.2047 0.2165 0.0551 0.0630 Millimeters Min. Max. 2.20 2.80 *2.30 0.90 0.80 5.20 5.50 1.40 1.60 Notes: 1.Dimension and tolerance based on our Spec. dated May. 05,1996. 2.Controlling dimension: millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material: * Lead: 42 Alloy ; solder plating * Mold Compound: Epoxy resin family, flammability solid burning class: UL94V-0 Important Notice: * All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. * HSMC reserves the right to make changes to its products without notice. * HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. * HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory: * Head Office (Hi-Sincerity Microelectronics Corp.): 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel: 886-2-25212056 Fax: 886-2-25632712, 25368454 * Factory 1: No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel: 886-3-5983621~5 Fax: 886-3-5982931 HJ127 HSMC Product Specification |
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